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Facility Feature: Clean Room

by Aaron Stein

steinAaron Stein

Whether producing simple metallic pads for probing exciting new nanoscale systems or structuring more complicated geometries into silicon and other materials, nanofabrication lies at the heart of much of the work at the CFN. The nanofabrication facility at the CFN is located in the extensive clean-room area at the rear of the building. Inside are three bays filled with new, state-of-the-art equipment available for use by the CFN staff, the Brookhaven community and all of our external users. The thin-film area houses physical and chemical vapor deposition systems for depositing metals, oxides and nitrides as well as plasma etch tools for removal of films. These include a deep reactive ion etcher using the Bosch process for etching of silicon up to 100 microns deep. In the lithography room users can pattern substrates with optical or nanoimprint technology. The focused ion/electron dual-beam system is the nano Swiss Army knife of the fabrication facility, featuring nanoscale patterning with electron beams and ion beams, direct beam-induced deposition of platinum wiring and high-resolution imaging and spectroscopy. A profilometer and additional microscopy provide the necessary inspection and measurement capabilities to assist in process development and sample metrology.

clean room

The CFN clean room.

We have an experienced staff to guide users and help develop the process parameters that are right for each individual project. Together, Fernando Camino, Don Elliott, John Warren and myself count several decades of fabrication experience.

The clean room is 100% operational and already has a bustle of users and scientists on the equipment every day. New proposals are welcomed and potential users should not hesitate to contact any of the clean room staff.

The major equipment in the facility includes:

JEOL JBX9300-FS (at Alcatel-Lucent)
An electron-beam lithography system with 1 nm placement accuracy over 0.5 mm field to pattern e-beam sensitive photoresist with a <20 nm minimum line width.

FEI Helios NanoLab
A dual-beam focused ion/electron-beam tool for directed-beam ion milling in any material with a resolution of 100 nm, direct electron and ion-beam induced deposition of platinum and ion implantation in selected nanoscale areas.  Nanopatterning by both electron and ion beams. Additionally, EDX analysis spectroscopy and TEM sample preparation. High-resolution imaging at up to 4 million times magnification, including STEM detector.

Molecular Imprints Imprio 55:
Nanoimprinter uses step-and-flash imprint method to pattern nanoscale features from quartz template. Sub-micron alignment capabilities available.

 

Karl Suss MJB3
Contact aligner for standard optical lithography

Trion Orion III
Plasma Enhanced Chemical Vapor Deposition (PECVD) of thin films – silicon dioxide, silicon nitride, etc.

Trion Phantom III
Reactive ion etcher for oxides.

Kurt Lesker PVD-75
Two systems -- 3-head sputter coater and 4-pocket electron beam evaporator. For depositing thin films of metals, etc.

Zygo NewView profilometer
Optical measurement of sample profile. Full range of ancillary fabrication equipment including resist processing, thermal evaporator, rapid thermal anneal (RTP), oxygen plasma asher, optical microscopy, profilometry.

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