Multi-layer Protection Hazard Management
for Manufacturing Facilities
Vasilis M. Fthenakis
Environmental Research & Technology Division
This paper presents strategies for reducing environmental health and safety (EHS) hazards in semiconductor facilities. These strategies include layers of prevention and mitigation in six sequential steps. The options for prevention are related to safer technologies, processes, and materials, safer use of materials, preventing accident-initiating events, preventing or minimizing releases, and preventing human exposures. The mitigation options include passive and active engineering systems (e.g., secondary confinement, flow restricting and shut-off valves, emergency scrubbers), and administrative programs (e.g., emergency preparedness and response) adsorption units. These protection layers are independent, so that if one fails, then others are available. As the industry implements these strategies in a systematic and vigilant manner, the risk to the industry, the workers, and the public will become minimal.
Last Modified: June 18, 2008