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High Density Interconnect Laboratory

The Instrumentation Division develops high-density, high pixel count detectors for Brookhaven Lab research programs. The detectors are composed of pixel sensors with pitch on few tens to few hundred micrometers to be connected one-to-one to matched low-noise, application-specific integrated circuits (ASICS). This is accomplished with the following processes.

  • Aluminum fine pitch Wire Bonding
  • Gold bumping for flip chip applications and Wire Bonding
  • Semi-automatic flip chip bonder for various attach applications.
  • Epoxy die attach and placement
  • Epoxy dispensing, conformal coating, under fill capability
  • Rework and testing including die shear and wire bond pull tests