Test sheets and check list for the spectrometer hybrid and module assembly.
The following testsheets comment on the work flow of the hybrid and module assembly. They are intended as checklists to be filled in by the person performing a specific task. The test sheet will travel with the hybrid/module in order to allow a immediate overview of the work which is completed or still remains to be done. Test sheets and task can also be downloaded as Excel file
OLD versions of the test sheets and task can be downloaded as OLD Excel file
The test sheet:
Note that the testsheets shown on this page are OLD versions! Use the link above to get the current ones
| Hybrid Type | |||||
| Hybrid Serial Number | |||||
| Task | by | date | passed/failed | comments | |
| Visual Inspection | ok failed | ||||
| Ohmic Test | ok failed | ||||
| Subplate Mount | ok failed | ||||
| Chip Gluing | ok failed | ||||
| Cleaning (only if needed) | ok failed | ||||
| Hybrid-Chip bond | ok failed | ||||
| Readout Bond Inspection | ok failed | ||||
| Tests 1 | by | date | pass test ? | list non-funct. string/chip | file name |
| HybridCalTest | ok failed | ||||
| Chip-Hybrid rebond | ok failed | ||||
| Change Hybrid Chip | ok failed | ||||
| Tests 2 | by | date | pass test ? | list non-funct. string/chip | file name |
| HybridCalTest | ok failed | ||||
| Chip-Hybrid rebond | ok failed | ||||
| Change Hybrid Chip | ok failed |
Comment on the individual task:
| ACTION | ACTION_ORDER | DESCRIPTION |
| Visual Inspection | 10 |
visual inspection before SMD assembly |
| Ohmic Test | 20 |
ohmic test before SMD assembly |
| SMD assembly | 30 |
assembly of connector and SMD assembly |
| TempProbeMount | 40 |
mounting of Temp Probe |
| TempProbeBond | 50 |
bonding of Temp Probe |
| TempProbeSeal | 60 |
epoxy sealing of bonded probe |
| Cleaning (only if needed) | 70 |
cleaning of bonding areas |
| Subplate Mount | 80 |
gluing of subplates and inserts to hybrid |
| Chip Gluing | 90 |
Gluing of chips to hybrid |
| Hybrid-Chip bond | 100 |
Bond chip readout side to hybrid |
| Readout Bond Inspection | 110 |
Check hybrid for broken/missing bonds |
| HybridCalTest | 120 |
Test of hybrid function with cal pulse |
| Chip-Hybrid rebond | 130 |
rebonding of broken/missing bonds |
| Change Hybrid Chip | 140 |
change chip on hybrid |
The module Test sheet:
| Module Number | |||||
| Module Type | |||||
| Left-Type Hybrid | Sensor 0 | Sensor 2 | |||
| Right-Type Hybrid | Sensor 1 | Sensor 3 | |||
| Task | by | date | passed/failed | comments | |
| SenorGluing | ok failed | ||||
| CrossbarGlueing | ok failed | ||||
| GlassEnforcement | ok failed | ||||
| KaptonProtection | ok failed | ||||
| SensorChipBond | ok failed | ||||
| GuardBiasBond | ok failed | ||||
| Backplane connection | ok failed | ||||
| ModPrimeCalTest | ok failed | ||||
| ModPrimeSrcTest | ok failed | ||||
| BiasCaps | ok failed | ||||
| ModCalTest | ok failed | ||||
| ModSrcTest | ok failed | ||||
| Tests 1 | by | date | pass test ? | list non-funct. string/chip | file name |
| ModPrimeCalTest | ok failed | ||||
| Replace Chip | ok failed | ||||
| ModCalTest | ok failed | ||||
| Tests 1 | by | date | pass test ? | list non-funct. string/chip | file name |
| ModPrimeSrcTest | ok failed | ||||
| ModSrcTest | ok failed |
Comments on the individual task for the module:
| ACTION | ACTION_ORDER | DESCRIPTION |
| SenorGluing | 500 |
gluing of sensor to hybrid(s) |
| CrossbarGlueing | 510 |
reenforing modules with crossbar |
| GlassEnforcement | 520 |
reinforce glasspiece glue joint |
| KaptonProtection | 530 |
glue katon strip to high sensor |
| SensorChipBond | 540 |
bond sensor to chips |
| GuardBiasBond | 550 |
bond sensor guard/bias on "left"-hybrid |
| Backplane connection | 560 |
glue bias resistors and backplane wire |
| ModPrimeCalTest | 570 |
test module with calibration signals |
| ModPrimeSrcTest | 580 |
test sensor signal and current w/ source |
| BiasCaps | 590 |
glue backplane by-pass caps |
| ModCalTest | 600 |
test final module w/ calibration pulses |
| ModSrcTest | 610 |
test final module w/ source |
| Replace Chip | 620 |
replace chip on final module |