Individual boxes for each M-substrate (or finished module later on ) are preferable for handling and testing. Each set of M-substrates (one or two) for one module are stored and tested in this boxes. After the sensors are glued to the MS the finished module is handled and tested in the same box.

• Testing: access over the full silicon and M-substrates area on top and back of the module. This seems necessary for (a) sufficient space to contact individual components during the tests and (b) to give access for works on the back of the MS (bias resistors and back-plane connection)
• Transport & Handling: The box should provide protection to the module. Metal is preferred as is also provides electrical shielding during tests
• The box has to be reasonable light tight (tests with bias on the sensors)
• During long time tests the module has to be cooled
• No mechanical stress on the module

The first layout proposed is a metal (Al) box (10x7x1 inch) with has a light-weight frame inside that supports the module. The frame fixes the module in the box and allows to take it out for bonding and tests where cooling is required. It has full access from top and bottom. The inner and outer dimensions seem appropriate for reasonable access to the module and comfortable testing. The height is small as to allow access to the MS with micropositioners (probing on the M-substrate and chips)