Number of units are for TWO arms
Module type 1 - 8 units
Planes A, B, C, and D are identical. Each consists of two wafers (type 1) mounted as a
single module with a total length of 140.8 mm. Each module has double electronics on both
the top and bottom. There are 12 128-channel chip sets on both top and bottom, for a total
of 24 chip sets, fed by 2 flex cables, two on both the top and bottom. All flex cables
come out on the non-beam side.
Module type 2 - 6 units
Planes E, F, and H contain only wafer number 2. Plane E, F, and part of H consist of 1
module with 4 wafers for a total length of 170.55 mm. Each module contains 16 single chip
sets on both top and bottom, for a total of 32 chip sets, fed by 2 flex cables, 1 on both
the top and bottom. These flex cables come out on the non-beam side.
Module type 3 - 2 units WAS REPLACED BY MODULE 7-TYPE2
The OLD module:Plane H has 5 wafers, of which 4 are contained in a module type 2 but
thelast wafer must be its own module. This module has 1 wafer, 4 single chip sets on both
the top and bottom fed by 2 flex cables, 1 on both the top and bottom. These cables
probably need to come out on the beam side.
The NEW module: Plane H will be equipped with 2 modules MOD7-T2. Currently there is no
decision wether both modules will be on the same side or on opposite sides.
Module type 4 - 18 units
This module type consists of 4 wafers of either type 4 or 5 (6 with wafer type 4, 12 with
wafer type 5), for a total length of 170.55 mm. These wafers are bonded on only one side
to 4 single chip sets per wafer for a total of 16 chip sets per module, fed by one flex
cable. Some of these modules will be mounted upside down so the electronics and flex cable
are on the bottom. It is hoped that we will not need both left-handed and right-handed
versions. This module is found in sections I1, J1, L1, M2, M3, N2, O3, P1, and P3
Module type 5 - 34 units
This module type consists of 3 wafers of either type 4 or 5 (6 with wafer type 4, 28 with
wafer type 5), for a total length of 128.53 mm. These wafers are bonded on only one side
to 4 single chip sets per wafer for a total of 12 chip sets per module, fed by one flex
cable. Some of these modules will be mounted upside down so the electronics and flex cable
are on the bottom. It is hoped that we will not need both left-handed and right-handed
versions. This module is found in sections K1, K2, M1, M2, N2, O1, O2, O3, P1, and P3.
Module type 6 - 4 units
Planes I2, and J2 contain only wafer number 3. They both consist of 1 module with 4 wafers
for a total length of 170.55 mm. Each module contains 16 mm single chip sets on both top
and bottom, for a total of 32 chip sets, fed by 2 flex cables, 1 on both the top and
bottom. The flex cables will come out on the beam side.
Module type 7 - 8 units
This module type consists of 3 wafers of type 3, for a total length of 128.53 mm. These
wafers are bonded on both sides to 4 single chip sets per wafer for a total of 24 chip
sets per module, fed by 2 flex cable, 1 on both the top and bottom. This module is found
in sections M4, N4, O4, and P4. The flex cables will come out on the beam side.
Module type 8 - 4 units WAS REPLACED BY Module 6
The OLD module:This module consists of 2 wafers of type 4 and two wafers of type 3. On the
top, there will be 16 single chip sets, fed by 1 flex cable. On the bottom, there will be
only the 8 single chip sets on the type 3 wafer, also fed by 1 flex cable. The two flex
cables will come out the beam side. This module is found in sections K3/4 and L3/4.
The NEW module: is identical to module 6. On the expenses of 512 additional
channel(=8chips)/module we can streamline the production by reducing the number of
DIFFERENT modules we have to build.