Friday, March 14, 2008, 2:00 pm — Conference Room, Bldg 815
The ability to make electromechanical devices using flexible substrates provides great opportunities for the future due to their unique properties, low cost and ease of manufacturing. Current techniques of electrode deposition on flexible substrates still use conventional methods such as evaporation, sputtering and vacuum deposition. These methods are costly and difficult to use without proper training. An easier approach is to use solution-based assembly, which is simple, less expensive, and provides a number of parameters to control film properties. This talk will focus on various methods of solution-based assembly on flexible substrates and some potential applications.
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