Condensed-Matter Physics & Materials Science Seminar
"Tailoring electronic and thermal properties of bulk Cu26T2(Ge,Sn)6S32 colusite through defects engineering and functionalization of the conductive network"
Presented by Emmanuel Guilmeau, CRISMAT Laboratory, Caen, France
Thursday, April 11, 2019, 1:30 pm — Bldg. 734, ISB Conference Room 201 (upstairs)
A complete study of the structure and thermoelectric properties of colusite Cu26T2(Ge,Sn)6S32 (T = V, Cr, Mo, W) is presented. A brief introduction provides a state-of-theart/survey of thermoelectric sulfides, with a special focus on the structural features and transport properties relationship in Cu-based sulfides. In the first part of this presentation, we highlight the key role of the densification process on the formation of short-to-medium range structural defects in Cu26V2Sn6S32 . A simple and powerful way to adjust carrier concentration combined with enhanced phonon scattering through point defects and disordered regions is described. By combining experiments with band structure and phonons calculations, we elucidate, for the first time, the underlying mechanisms at the origin of the intrinsically low thermal conductivity in colusite samples as well as the effect of S vacancies and antisite defects on the carrier concentration. In the second part, we demonstrate the spectacular role of the substitution of V5+ by hexavalent T6+ cations (Cr, Mo and W) on the electronic properties, leading to high power factors . In particular, Cu26Cr2Ge6S32 shows a value of 1.53 mW m-1 K-2 at RT that reaches a maximum value of 1.94 mW m-1 K-2 at 700 K. The rationale is based on the concept of conductive "Cu-S" network, which in colusites corresponds to the more symmetric parent sphalerite structure. The interactions within the mixed octahedral-tetrahedral [TS4]Cu6 complexes are shown to be responsible for the outstanding electronic transport properties.  C. Bourgès et al., J. Amer. Chem. Soc. 140 (2018) 2186  V. Pavan Kumar et al., Adv. Energy Mater. 9 (2019) 1803249
Hosted by: Qiang Li
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