Center for Functional Nanomaterials Seminar

"Direct Polymer Curing Transfer and Surface Modification of 2D materials for Flexible Electronics"

Presented by Yeonhoo Kim, Center for Integrated Nanotechnologies, Los Alamos National Laboratory

Friday, June 11, 2021, 1:00 pm — Videoconference / Virtual Event (see link below)

Two-dimensional (2D) materials, such as graphene and transition metal dichalcogenides, exhibit great potential as functional materials for numerous novel applications due to their excellent properties. The grafting of conventional micropatterning techniques such as MEMS (micro-electromechanical system) on new types of electronics based on 2D materials is required to fully utilize the unique nature of 2D materials in practical applications. However, the conventional lithography and polymer-supported wet transfer methods often induce contamination and damage on micropatterned 2D materials due to polymer residues and harsh wet-transfer conditions. Furthermore, the dangling bonds and defects on basal planes and edge sites of 2D materials provide opportunities to modify surface chemistry. Thus, the surface modification employing noble metal nanoparticles and functionalization is considered as a key strategy to achieve superior electronic properties since it enables to modulate the chemical and electrical properties of 2D materials for target applications.

Here, my research on the synthesis, materials design, and microfabrication techniques for advanced electronic materials is presented. I devised a novel strategy to fabricate large-scale flexible electronics based on graphene micropatterns by using a direct polymer curing method. Four graphene micropatterns with self-heating effect and catalytic noble metal decoration are utilized as a sensor array to discriminate gas species. In addition, modified surface chemistry of 2D materials using catalytic nanoparticles (e.g., Au, Pt, Ag, Pd) and functional groups improves sensitivity and selectivity of sensor devices.

Hosted by: Gregory Doerk

Videoconference Instructions

Meeting ID: 161 466 8145 Passcode: 148631

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