Optics Fabrication

Thin Films and Multilayers Deposition System

Our one of a kind deposition system is equipped with 9 magnetron sputtering cathodes as well as a wafer curvature measurement system and an ion source. A precision in-vacuum linear motor servo system raster scans a substrate over an array of magnetrons with shaped apertures at well-defined velocities to affect a multilayer coating. Thanks to these feature, the system is capable of growing combined depth-graded and laterally-graded multilayers with precise thickness control over many thousands of layers, providing total film growth in one run of up to 100 microns thick or greater.

Many materials possible such as: Au, B4C, C, Co, Cr, Mo, MoSi₂, Ni, Pt, Rh, Sc, Si, V, W, WSi₂…

Bruker D8 Discover Diffractometer

• High precision, two-circle goniometer
• Cu anode
• 4 bounce Ge monochromator + Göbel mirror
• Standard operation: 40kV, 40mA
• Smallest step size: 0.0001o
• Samples size: 50-150mm diameter
• Maximum sample height: 90 mm
• Anti-scatter slit assembly
• LynxEye Detector (1-dimensional strip detector), NaI Scintillation detector

J.A. Woollam Co., Inc. M-2000 Ellipsometer with Auto Angle Base

• 470 wavelengths from 245nm to 1000nm
• All wavelengths acquired simultaneously
• Collimated light beam
• Auto angle base ranging from 45o to 90o
• Automated sample height alignment
• Detachable focusing optics to reduce beam diameter to 300μm.
• Camera to view light beam location on the sample
• Automated 300mm XY sample translation/mapping
• Automated tip-tilt alignment.

Dektak 150 Step Height Profilometer

• Motorized XY stage, 150mm x 150mm travel, 1µm repeatability
• Scan length up to 55mm
• Samples up to 60mm thick
• Maximum wafer size : 150mm
• Vertical range: 524μm
• Vertical resolution: 1Å max (at 6.55μm range)
• Wafer alignment pins for ease of use
• Superior step-height repeatability
• Precise step-height measurements for:
  • thin films down to 10 angstroms,
  • thick-film measurements up to several hundred microns thick

Wet Etching / Mirrors Coating Stripping

• Chromium, Gold, Aluminum, Nickel etching
• HF

ADT 7100 Dicing Saw

• Easy load/unload
• Automated
• Advanced process capabilities
• 4” spindle
• Sample size up to 8” diameter

WS22 Princeton Scientific Precision Wire Saw

• For cutting or slicing hard and brittle materials
• Wire frequency 300 or 400/min
• Wire diameter: 20-60μm
• Max sample diameter : 80mm
• Accuracy of positioning better than 0.5o

Buehler Ecomet/Automet 250 polisher

• 8” plater
• Variable base speed: 10-500rpm
• Power head with single and central force, variable speed 30-60rpm
• Selection of grinding paper and polishing cloths