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Nanofabrication Facility
The Nanofabrication Facility is housed in a class 100/1000 clean room (5,000 sq. ft) dedicated to state-of-the art patterning and processing of thin films, nanomaterials, and devices. The instrumentation in the facility has been optimized to provide maximum flexibility for its users, with capabilities to pattern a variety of materials over a wide range of size scales, from 10 nanometers to 10 millimeters. The clean room is used to fabricate devices for nanoelectronics, nanophotonics, biomedical engineering, photovoltaics, x-ray optics, nanomagnetics and beyond.
Lithography
Electron Beam Lithography
JEOL JBX-6300FS
Contact: Nikhil Tiwale, Ming Lu
Dedicated electron beam lithography system, operated at 100 keV is capable of patterning feature sizes as small as 8 nm. The system provides capability of high-speed, large-area exposures (1mm field size) and sub-20 nm overlay and stitching accuracy. The system can handle sample substrates from 5mm up to 3” or 4” wafers, as well as 4” photomasks.
Helios G5
Contact: Fernando Camino
Equipped with NPGS system, available for electron beam lithography patterning at lower acceleration voltages between 0.5 - 30 keV on relatively smaller (few cm) sized samples.
3-D Nanolithography
Nanoscribe Photonic Professional GT
Contact: Ming Lu
Automatic laser-based 3D nano-printer, capable of creating 3D polymeric models down to sub-200 nm resolution using the two-photon polymerization technique.
Focused Ion Beam (FIB) Patterning
Helios G5
Contact: Fernando Camino
FIB can be operated in unison with the NPGS system for directly patterning substrates via ion-beam milling.
Photolithography
Karl Suss MA6
Contact: Nikhil Tiwale
Contact mask aligner is used to pattern features as small as 1 um using UV exposure at 405 nm or 240 nm wavelength and a suitable mask. Substrate sizes range from small chips (~10 mm x 10 mm) to 4” diameter wafers.
Thin-Film Deposition
Physical Vapor Deposition
Kurt J. Lesker PVD 75
Contact: Nikhil Tiwale, Gwen Wright
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Thermal/electron-beam evaporator dedicated for high-purity device contact materials
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3-target magnetron DC/RF sputter deposition system with source shutter
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4-pocket electron beam deposition system for various oxides and metal deposition
Plasma Enhanced Chemical Vapor Deposition
Trion Orion III PECVD
Contact: Ming Lu
Deposition of thin films of Si, SiO2, Si3N4, and SiOxNy on samples/wafers up to 6" in diameter.
Reactive Ion Etching
Trion Phantom III
Contact: Ming Lu
General-purpose fluorine-based plasma etch tool for etching thin films (generally 1 µm or less in thickness) on samples/wafers up to 6" in diameter. Many processes for etching thin layers of photoresist, metal, semiconductors, or insulators are available.
Oxford Instruments Plasmalab 100 (Oxford C) [Contact: Ming Lu]
A fully loaded inductively coupled plasma (ICP) reactive ion etch tool which is configured for etching compound semiconductors, metals, metal oxides, silicon and dielectric materials with 12 process gases (Cl2, BCl3, SiCl4, HBr, H2, CH4, SF6, CF4, C4F8, O2, Ar and N2).The system has demonstrated the capability to etch vertical walls in silicon to a depth of 300 µm at etch rates of 3 µm / min with an aspect ratio (width of feature to etch depth) of 50:1.
Oxford Instruments Plasmalab 100 (Oxford F) [Contact: Ming Lu]
Uses an inductively coupled plasma (ICP) source for etching silicon and dielectric materials using fluorine chemistry. The system has been upgraded with Cobra® ICP plasma source and a separate RF generator driving substrate DC bias which allows for superior control of radicals and ions during the plasma processing. The system has demonstrated the capability to etch vertical walls in silicon to a depth of 300 µm at etch rates of 3 µm / min with an aspect ratio (width of feature to etch depth) of 50:1.
Atomic Layer Etching
Plasma-based atomic layer etching system is being installed for layer-by-layer etching of materials. Under commissioning…
Metrology
Dual Scanning Electron Microscope (SEM) / Focused Ion Beam (FIB) system
Helios G5
Contact: Fernando Camino
Dual-beam systems capable of simultaneous focused ion beam milling and SEM imaging. The systems are capable of high-resolution SEM (1 nm), FIB (5 nm), and STEM (0.8 nm) imaging. Further capabilities include gas injector for electron or ion beam-assisted deposition of platinum and TEOS (dielectric), x-ray detector for EDS analysis, nano-manipulator probe, and in-situ sample electrical characterization.
Electron Beam Induced Current (EBIC) Imaging
Helios G5
Contact: Fernando Camino
EBIC is an analysis technique in the SEM, which creates images using the electrical response of the sample as a function of the scanning position of the electron beam.
Thin film Metrology
Contact: Nikhil Tiwale
Dektak 150 Stylus Profilometer, Filmetric F20 surface reflectometer, and Nikon optical microscopes are available for nanofabrication facility users.
3-D Laser Lithography System (Photonic Professional GT)
3-D Litho:
This tool (Nanoscribe Photonic Professional GT) is an automatic 3-D nanolithography system/3-D printer capable of creating polymer patterns/models down to sub-200 nm resolution using two-photon polymerization technique.
Deep Reactive Ion Etcher (DRIE), w/Bosch process-Oxford F
Silicon DRIE:
This system has demonstrated capability to etch vertical walls in silicon to a depth of 300 µm at etch rates of 3 µm / min with an aspect ratio (width of feature to etch depth) of 1:50. It has a laser interferometer endpoint detector (shared with the other Oxford ICP RIE tool) to help achieving an accurate etching depth.
Electron Beam Induced Current (EBIC) Imaging-Helios G5
Electron Beam Induced Current (EBIC) Imaging:
EBIC is an analysis technique in the SEM, which creates images using the electrical response of the sample as a function of the scanning position of the electron beam.Electron Beam Lithography Tool (EBL)
Ebeam Litho:
The JEOL JBX-6300FS is a state-of-the-art 100kV EBL tool providing high-speed patterning capabilities with feature sizes as small as 8 nm over mm-scale areas.
Helios G5 Dual Beam SEM/FIB Microscope
Helios G5 Dual Beam SEM/FIB Microscope:
Excellent electron and FIB imaging resolution (including at FIB energies below 2 keV). It possesses an array of imaging, analysis, device fabrication, electrical characterization, and TEM sample preparation capabilities.
In-Situ Electrical Characterization-Helios G5
The Helios G5 has two ways to perform in-situ electrical characterization. One is to use the 7-pin SMA electrical feedthrough, which requires fixed wiring of the electrodes to the sample or device. The other is to perform two-terminal electrical probing (no need for fixed wiring) using two Kleindiek Nanotechnik robotic manipulators (fA-range current measurement resolution and nanometer scale positioning resolution).Lesker Electron Beam Deposition System
Ebeam Deposit:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Lesker Sputter Coater
PVD75 Coater:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Lesker Thermal/E-beam evaporator for electrical contacts
Contacts Evaporator:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Oxford Chlorine Etcher C (RIE-C)
Oxford Metal Etcher:
This ICP Reactive Ion Etching system (Oxford Instruments Plasmalab 100) has an inductively coupled plasma source for high-speed, anisotropic plasma etching.
Plasma Enhanced Chemical Vapor Deposition (PECVD) System
Trion PECVD:
This deposition system (Trion Orion III) provides plasma-enhanced chemical vapor deposition of thin films. Current capabilities include precursor gases for deposition of SiO2, Si3N4, and amorphous silicon films.
UV Mask Aligner
UV Mask Align:
The system (Karl Suss MA-6 UV Mask Aligner) is capable of exposing photoresist patterns down to 1 micron resolution with UV light at two wavelengths (405 nm and 240m nm).
Constant Temperature bath (-20°C to 100°C)
Dektak 150 Stylus Profilometer
Dektak 150 Stylus Profilometer:
Single scan contact profilometer with a scan length range 50 um to 55 mm and a sub 1 nm specified vertical resolution.
General purpose Reactive Ion Etcher (Cleanroom)
Trion RIE:
The general purpose plasma etch tool (Trion Phantom III) is used for etching thin films generally 1 µm or less in thickness.
L-EDIT (CAD)
Layout Beamer (pattern fracture & proximity effect correction)
Liquid CO2 Critical Point Dryer (Autosamdri-815B)
CPD:Plasma Asher
Plasma AsherReflectometer
Filmetric F20:
This tool (Filmetrics F20) is a spectro-reflectometer which measures the thickness and reflective index of thin film deposited on flat substrate. It can handle samples with multilayer thin film.