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Equipment Catalog

Advanced Optical Spectroscopy and Microscopy

Major Equipment

Minor Equipment

Advanced UV and X-ray Probes

Major Equipment

Electron Microscopy

Major Equipment

  • Analytical Bio/Soft Matter Transmission Electron Microscope (TEM)

    JEOL 1400 TEM:

    The JEOL JEM-1400 LaB6 120 kV transmission electron microscope is an easy-to-use, high contrast instrument with excellent imaging (TEM and STEM modes) and analytical (energy dispersive spectroscopy detector) capabilities. 

  • Environmental Transmission Electron Microscope (E-TEM)

    Titan 80-300:

    The E-TEM instrument (FEI Titan 80-300) is an 80 – 300 kV field-emission transmission electron microscope with an objective-lens aberration corrector at spatial resolution of 0.08 nm.  The instrument has scanning transmission imaging, magnetic imaging, and chemical analysis capabilities.

  • FEI TALOS Operando S/TEM

    FEI TALOS:

    The FEI Talos F200X is a high-resolution analytical scanning/transmission electron microscope (S/TEM) that is routinely operated at 200 keV. This microscope is equipped with an X-FEG electron source module that gives a source brightness four times that of a Schottky FEG emitter. 

  • High Resolution Analytical Transmission Electron Microscope (HRTEM)

    JEOL 2100F:

    This is the center’s workhorse instrument. It is a 120-200kV scanning transmission and transmission field-emission electron microscope (STEM/TEM) for high-resolution analytical structural characterization. 

  • Scanning Transmission Electron Microscope (STEM)

    Hitachi 2700C:

    This instrument is ideal for probing structural and electronic properties of materials at the Angstrom level, allowing on to study the physical, chemical and electronic structure of oxide interfaces, catalysts and other functional nanomaterials.  

Minor Equipment

  • Dimpler

    Gatan Dimpler:

    The Gatan Dimple Grinder is high precision instrument used in the mechanical pre-thinning (~5 microns thick) of disk shaped samples to near electron transparency over large areas and greatly reducing subsequent ion milling time. 

  • Dimpler

    D500I Dimpler:

    The South Bay Technology Dimple Grinder is high precision instrument used in the mechanical pre-thinning (~5 microns thick) of disk shaped samples to near electron transparency over large areas and greatly reducing subsequent ion milling time. 

  • High Resolution Ion Beam Coater

    Gatan 681 Coater:

    The Gatan Model 681 is ion beam sputter coating instrument for producing continuous, ultra thin, amorphous coatings on samples that are ideal for FESEM and TEM applications. 

  • Nanomill

    Nanomill:

    The Fischione Model 1040 NanoMill is a low energy Argon ion mill that is primarily used for removing the amorphous Ga+ damage layer on TEM samples previously prepared by focused ion beam (FIB).  

  • Precision Ion Polishing System (PIPS2) - Gatan 695

    Gatan PIPS2:

    The Gatan Model 695 Precision Ion Polishing System (PIPSII) is used for non mechanical thinning of primarily materials samples for TEM analysis. 

  • Techprep Automatic Polisher

    Multiprep Automatic Polisher:

    The Allied Multiprep automatic polisher allows for the preparation of a wide range of materials for microscopic analysis (electron microscopy as well as optical). Polishing capabilities include parallel polishing, angle polishing, and site-specific polishing. 

Materials Synthesis and Characterization

Major Equipment

Minor Equipment

Nanofabrication

Major Equipment

  • 3-D Laser Lithography System (Photonic Professional GT)

    3-D Litho:

    This tool (Nanoscribe Photonic Professional GT) is an automatic 3-D nanolithography system/3-D printer capable of creating polymer patterns/models down to sub-200 nm resolution using two-photon polymerization technique.

  • Deep Reactive Ion Etcher, available w/Bosch process (DRIE)

    Silicon DRIE:

    This system has demonstrated capability to etch vertical walls in silicon to a depth of 300 µm at etch rates of 3 µm / min with an aspect ratio (width of feature to etch depth) of 1:50. It has a laser interferometer endpoint detector (shared with the other Oxford ICP RIE tool) to help achieving an accurate etching depth. 

  • Dual Beam SEM/FIB Microscope

    Dual Beam SEM/FIB Microscope:

    The dual beam SEM/FIB system is capable of simultaneous focused ion beam milling and SEM imaging.  

  • Dual Beam Scanning Electron/Focused Ion Beam Microscope

    Dual Beam:

    Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.

  • Electron Beam Deposition System

    Ebeam Deposit:

    Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials. 

  • Electron Beam Lithography Tool (EBL)

    Ebeam Litho:

    The JEOL JBX-6300FS is a state-of-the-art 100kV EBL tool providing high-speed patterning capabilities with feature sizes as small as 8 nm over mm-scale areas. 

  • General purpose Reactive Ion Etcher (RIE)

    Trion RIE:

    The general purpose plasma etch tool (Trion Phantom III) is used for etching thin films generally 1 µm or less in thickness. 

  • Oxford Chlorine Etcher C (RIE-C)

    Oxford Metal Etcher:

    This ICP Reactive Ion Etching system (Oxford Instruments Plasmalab 100) has an inductively coupled plasma source for high-speed, anisotropic plasma etching. 

  • Plasma Enhanced Chemical Vapor Deposition (PECVD) System

    Trion PECVD:

    This deposition system (Trion Orion III) provides plasma-enhanced chemical vapor deposition of thin films. Current capabilities include precursor gases for deposition of SiO2, Si3N4, and amorphous silicon films. 

  • UV Mask Aligner

    UV Mask Align:

    The system (Karl Suss MA-6 UV Mask Aligner) is capable of exposing photoresist patterns down to 1 micron resolution with UV light at two wavelengths (405 nm and 240m nm).

Minor Equipment

Proximal Probes

Major Equipment

Minor Equipment

Theory and Computation

Major Equipment

  • Software and Computational Services

    Computer clusters, software and data storage:

    We have diverse software tools that include deep learning frameworks, density functional theory packages for solids, surface and quantum chemistry, molecular-dynamics packages, and specialized tools for electronic excitations and optical properties. 

Advanced Spectro-Microscopy

Major Equipment

  • XPEEM/LEEM Spectro-Microscopy Endstation

    XPEEM/LEEM:

    The CFN XPEEM/LEEM facility at the Electron Spectro-Microscopy (ESM, 21-ID-2) beamline at the National Synchrotron Light Source II  (NSLS-II) has capabilities for full-field imaging at nanometer scale, as well as the micro-spot spectroscopy, including  uXPS, uXAS and uARPES. The microscope is best suited for micro- spectroscopic investigation of conductive, crystalline surfaces with few nanometers spatial resolution.  

Deposition (Evaporators/Sputterers/Pecvd/Coaters)

Major Equipment

  • Atomic Layer Deposition Tool (ALD) Savannah S100

    Atomic Layer Deposition Tool:

    The tool (Cambridge Nanotech Savannah100) includes precursors for atomically precise growth of thin films of Al2O3, ZnO, TiO2, VOx, HfO2, and Pt, at growth temperatures as high as 300 °C. 

  • Electron Beam Deposition System

    Ebeam Deposit:

    Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials. 

  • Physical Vapor Sputter/Thermal Evaporator

    PVD:

    This thin film deposition system (Kurt J. Lesker PVD75) is used for the synthesis of inorganic thin films by thermal evaporation and DC magnetron sputtering.

  • Plasma Enhanced Chemical Vapor Deposition (PECVD) System

    Trion PECVD:

    This deposition system (Trion Orion III) provides plasma-enhanced chemical vapor deposition of thin films. Current capabilities include precursor gases for deposition of SiO2, Si3N4, and amorphous silicon films. 

  • Pulsed Laser Deposition System PLD/MBE 2300

    PLD 2300:

    The pulsed laser deposition system (PVD Products PLD-MBE 2300) is used for synthesis of complex metal oxides or nitride thin-films by laser ablation. 

Minor Equipment

  • Sputter Coater

    PVD75 Coater:

    Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.

  • Sputter/Coater

    Cressington 208HR Coater:

    This benchtop DC sputter coater deposits thin noble metal films (Au, AuPd, or Pt) by DC sputtering. It is typically used for preparing samples for scanning electron microscopy. 

  • Thermal/E-beam evaporator for electrical contacts

    Contacts Evaporator:

    Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials. 

Electrical Probing

Major Equipment

Minor Equipment

  • Battery Tester

    Battery Tester:

    This is advanced testing equipment for research and development of energy storage or electrochemical devices, such as batteries, supercapacitors, and fuel cells.

  • Scanning Photocurrent Microscope (SPCM)

    SPCM:

    Photocurrent imaging microscope capable of measuring maps of currents with submicron resolution from electrical devices incorporating semiconductor materials.  

Electron Microscopy

Major Equipment

  • Analytical Bio/Soft Matter Transmission Electron Microscope (TEM)

    JEOL 1400 TEM:

    The JEOL JEM-1400 LaB6 120 kV transmission electron microscope is an easy-to-use, high contrast instrument with excellent imaging (TEM and STEM modes) and analytical (energy dispersive spectroscopy detector) capabilities. 

  • Dual Beam SEM/FIB Microscope

    Dual Beam SEM/FIB Microscope:

    The dual beam SEM/FIB system is capable of simultaneous focused ion beam milling and SEM imaging.  

  • Environmental Transmission Electron Microscope (E-TEM)

    Titan 80-300:

    The E-TEM instrument (FEI Titan 80-300) is an 80 – 300 kV field-emission transmission electron microscope with an objective-lens aberration corrector at spatial resolution of 0.08 nm.  The instrument has scanning transmission imaging, magnetic imaging, and chemical analysis capabilities.

  • FEI TALOS Operando S/TEM

    FEI TALOS:

    The FEI Talos F200X is a high-resolution analytical scanning/transmission electron microscope (S/TEM) that is routinely operated at 200 keV. This microscope is equipped with an X-FEG electron source module that gives a source brightness four times that of a Schottky FEG emitter. 

  • High Resolution Analytical Scanning Electron Microscope

    JEOL JSM-7600F:

    The JEOL JSM-7600F is a state-of-the-art thermal FE-SEM combining high resolution imaging with optimized analytical functionality. 

  • High Resolution Analytical Transmission Electron Microscope (HRTEM)

    JEOL 2100F:

    This is the center’s workhorse instrument. It is a 120-200kV scanning transmission and transmission field-emission electron microscope (STEM/TEM) for high-resolution analytical structural characterization. 

  • Scanning Electron Microscope (SEM)

    Hitachi SEM:

    This scanning electron microscope (Hitachi 4800 SEM) is a cold field emission instrument capable of 1.5 nm resolution at 15 kV and 2.5 nm resolution at 1 kV. 

  • Scanning Electron Microscope / Scanning Auger Microscopy / 4-point Transport Measurement of Nanostructures

    Nanoprobe:

    This Nanoprobe system is capable of performing scanning electron microscopy (SEM), scanning Auger microscopy (nanoSAM), 4-point probe measurements, and low energy electron diffraction (LEED).

  • Scanning Transmission Electron Microscope (STEM)

    Hitachi 2700C:

    This instrument is ideal for probing structural and electronic properties of materials at the Angstrom level, allowing on to study the physical, chemical and electronic structure of oxide interfaces, catalysts and other functional nanomaterials.  

Minor Equipment

  • Dimpler

    Gatan Dimpler:

    The Gatan Dimple Grinder is high precision instrument used in the mechanical pre-thinning (~5 microns thick) of disk shaped samples to near electron transparency over large areas and greatly reducing subsequent ion milling time. 

  • Dimpler

    D500I Dimpler:

    The South Bay Technology Dimple Grinder is high precision instrument used in the mechanical pre-thinning (~5 microns thick) of disk shaped samples to near electron transparency over large areas and greatly reducing subsequent ion milling time. 

  • High Resolution Ion Beam Coater

    Gatan 681 Coater:

    The Gatan Model 681 is ion beam sputter coating instrument for producing continuous, ultra thin, amorphous coatings on samples that are ideal for FESEM and TEM applications. 

  • Nanomill

    Nanomill:

    The Fischione Model 1040 NanoMill is a low energy Argon ion mill that is primarily used for removing the amorphous Ga+ damage layer on TEM samples previously prepared by focused ion beam (FIB).  

  • Precision Ion Polishing System (PIPS2) - Gatan 695

    Gatan PIPS2:

    The Gatan Model 695 Precision Ion Polishing System (PIPSII) is used for non mechanical thinning of primarily materials samples for TEM analysis. 

  • Techprep Automatic Polisher

    Multiprep Automatic Polisher:

    The Allied Multiprep automatic polisher allows for the preparation of a wide range of materials for microscopic analysis (electron microscopy as well as optical). Polishing capabilities include parallel polishing, angle polishing, and site-specific polishing. 

Etching and Ashing

Major Equipment

  • Deep Reactive Ion Etcher, available w/Bosch process (DRIE)

    Silicon DRIE:

    This system has demonstrated capability to etch vertical walls in silicon to a depth of 300 µm at etch rates of 3 µm / min with an aspect ratio (width of feature to etch depth) of 1:50. It has a laser interferometer endpoint detector (shared with the other Oxford ICP RIE tool) to help achieving an accurate etching depth. 

  • General purpose Reactive Ion Etcher (RIE)

    Trion RIE:

    The general purpose plasma etch tool (Trion Phantom III) is used for etching thin films generally 1 µm or less in thickness. 

  • Oxford Chlorine Etcher C (RIE-C)

    Oxford Metal Etcher:

    This ICP Reactive Ion Etching system (Oxford Instruments Plasmalab 100) has an inductively coupled plasma source for high-speed, anisotropic plasma etching. 

Minor Equipment

Lithography

Major Equipment

  • 3-D Laser Lithography System (Photonic Professional GT)

    3-D Litho:

    This tool (Nanoscribe Photonic Professional GT) is an automatic 3-D nanolithography system/3-D printer capable of creating polymer patterns/models down to sub-200 nm resolution using two-photon polymerization technique.

  • Dual Beam Scanning Electron/Focused Ion Beam Microscope

    Dual Beam:

    Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.

  • Electron Beam Lithography Tool (EBL)

    Ebeam Litho:

    The JEOL JBX-6300FS is a state-of-the-art 100kV EBL tool providing high-speed patterning capabilities with feature sizes as small as 8 nm over mm-scale areas. 

  • UV Mask Aligner

    UV Mask Align:

    The system (Karl Suss MA-6 UV Mask Aligner) is capable of exposing photoresist patterns down to 1 micron resolution with UV light at two wavelengths (405 nm and 240m nm).

Optical Microscopy

Major Equipment

Minor Equipment

Proximal Probes

Major Equipment

  • Ambient Pressure XPS & UPS with in vacuo IRRAS

    Lab AP-PES:

    This instrument allows for surface chemical analysis via core-level (XPS) and valance-level (UPS) photoelectron spectroscopy at gas pressures up to ~ 10 Torr and sample temperatures up to 500 °C.  Applications include in-operando studies of surface chemistry, catalysis, and energy storage processes.

  • Multiprobe Surface Analysis System - UHV/STM/XPS/UPS/ISS

    Multiprobe:

    Capable of surface structural characterization; surface chemical composition and electronic state characterization and UHV in-situ sample preparation and nanostructure fabrication. 

Minor Equipment

Rheology

Minor Equipment

  • Hybrid Rheometer

    Rheometer:

    The instrument is designed to measure mechanical/rheological properties of soft materials, including gels, liquids, and assemblies of macromolecules or nanoparticles at air-liquid interfaces. 

Scanning and Probing Microscopy

Major Equipment

Minor Equipment

Solution Based and Biomolecular Methods

Minor Equipment

Spectroscopic and Time-Resolved Probing

Major Equipment

  • Amplified Ti:Sapphire Laser System/Optical Parametric Amplifier-1 kHz

    Amplified Ti:Saph:

    The Amplified Ti:Sapphire Laser System is a state-of-the-art, high power kilohertz femtosecond regenerative amplifier combined with two optical parametric amplifiers that allow generation of sub 100 femtosecond pulses in the ultraviolet, visible, and infrared regions of the spectrum. 

  • Femtosecond Transient Absorption Spectrometer

    Transient Abs. Helios:

    Commercial absorption spectrometer capable to measure spectra and decays with 100 femtosecond resolution in VIS and NIR in combination with a 1 KHz regenerative amplifier and two TOPAS OPAs.

     

  • Nanosecond Transient Absorption Spectrometer

    Transient Abs. EOS:

    Commercial absorption spectrometer capable to measure spectra and decays with nanosecond  resolution in VIS and NIR in combination with a 1 KHz regenerative amplifier and two TOPAS OPAs. 

Minor Equipment

  • Circular Dichroism Spectrometer

    Jasco J-815 Circular Dichroism (CD) Spectropolarimeter:

    Circular dichroism (CD) spectroscopy measures differences in the absorption of left-handed polarized light versus right-handed polarized light that arise due to structural asymmetry.

  • FTIR Spectrometer

    Nicolet 6700 FT-IR Spectrometer: Fourier Transform Infrared (FT-IR) Spectrometer.

  • Fluorescence Up-conversion Spectrometer

    Halcyone Fluo:

    Commercial fluorescence upconversion spectrometer capable of measuring upconversion spectra and decays with 100 femtosecond resolution in VIS in combination with a 1 KHz regenerative amplifier and two TOPAS OPAs. 

  • Fluorimeter

    Horiba Nanolog Fluorimeter:

    This fluorimeter is best for organic and inorganic fluorescent materials, quantum dots, conductive polymers, protein, organic dyes.

  • Photon Counting Spectrofluorometer

    ISS PC1/K2 Fluorometer:

    This fluorometer (ISS PC1 Multifrequency Cross-Correlation Phase and Modulation Fluorometer) is capable of steady state and lifetime measurements (from 1 millisecond to 1 picosecond). 

  • Time Correlated Single Photon Counting Spetrometer

    Picoquant FT200:

    The Fluorescence Lifetime Spectrometer is used for time-resolved emission probing in UV-VIS-NIR (400-850nm, 950-1450nm). 

  • Uv-Vis Spectrophotometer

    Perkin-Elmer UV-Vis Lambda 25:

    UV/Vis Spectrophotometer

  • Uv-Vis/NIR Spectrophotometer with 60mm integrating sphere

    UV-VIS 950:

    In addition to liquid sample measurements, the instrument is equipped for studies of films and powders in specular and diffuse scattering regimes.  

Theory Computation & Software

Major Equipment

  • Software and Computational Services

    Computer clusters, software and data storage:

    We have diverse software tools that include deep learning frameworks, density functional theory packages for solids, surface and quantum chemistry, molecular-dynamics packages, and specialized tools for electronic excitations and optical properties. 

Thermal Analysis, Annealing and Electrochemistry

Minor Equipment

Thin Film Metrology

Minor Equipment

  • Dektak 150 Stylus Profilometer

    Dektak 150 Stylus Profilometer:

    Single scan contact profilometer with a scan length range 50 um to 55 mm and a sub 1 nm specified vertical resolution.

  • Reflectometer

    Filmetric F20:

    This tool (Filmetrics F20) is a spectro-reflectometer which measures the thickness and reflective index of thin film deposited on flat substrate. It can handle samples with multilayer thin film.

  • Spectroscopic Ellipsometer

    Woollam M2000:

    This ellipsometer (J.A. Woollam M-2000 Spectroscopic Ellipsometer) allows analysis and mapping of thin films and interfaces, with temperature control in air and liquids.  

X-Ray and Light Scattering

Major Equipment

Minor Equipment

  • Dynamic Light Scattering with Zeta Potential

    Malvern Zeta Sizer Nano Series:

    This instrument (Malvern Zetasizer Nano ZS and Zeta Potential) measures the size (0.6 nm to 6000 nm) and zeta potential of dispersed particles in solution using a 633 nm He-Ne laser. 

3D Surface Metrology in SEM

Major Equipment

Electron Beam Induced Imaging (EBIC) Imaging

Major Equipment

  • Dual Beam SEM/FIB Microscope

    Dual Beam SEM/FIB Microscope:

    The dual beam SEM/FIB system is capable of simultaneous focused ion beam milling and SEM imaging.  

FIB TEM Sample Prep (for TEM Users ONLY - for all other FIB sample prep, utilize 'Focused ion beam' under Lithography)

Major Equipment

  • Dual Beam SEM/FIB Microscope

    Dual Beam SEM/FIB Microscope:

    The dual beam SEM/FIB system is capable of simultaneous focused ion beam milling and SEM imaging.  

Focused Ion Beam

Major Equipment

Low Angle Backscattered Electron Detector (LABE)

Major Equipment

Pump-probe

Major Equipment

  • Amplified Ti:Sapphire Laser System/Optical Parametric Amplifier-1 kHz

    Amplified Ti:Saph:

    The Amplified Ti:Sapphire Laser System is a state-of-the-art, high power kilohertz femtosecond regenerative amplifier combined with two optical parametric amplifiers that allow generation of sub 100 femtosecond pulses in the ultraviolet, visible, and infrared regions of the spectrum. 

STEM imaging

Major Equipment

Sample Irradiation

Major Equipment

  • Amplified Ti:Sapphire Laser System/Optical Parametric Amplifier-1 kHz

    Amplified Ti:Saph:

    The Amplified Ti:Sapphire Laser System is a state-of-the-art, high power kilohertz femtosecond regenerative amplifier combined with two optical parametric amplifiers that allow generation of sub 100 femtosecond pulses in the ultraviolet, visible, and infrared regions of the spectrum. 

X-ray Energy Dispersive Spectroscopy (EDS)-Oxford Inca Energy

Major Equipment

X-ray Wavelength Dispersive Spectroscopy (WDS)-Oxford Inca Wave

Major Equipment

Zscan/Nonlinear Absorption

Major Equipment

  • Amplified Ti:Sapphire Laser System/Optical Parametric Amplifier-1 kHz

    Amplified Ti:Saph:

    The Amplified Ti:Sapphire Laser System is a state-of-the-art, high power kilohertz femtosecond regenerative amplifier combined with two optical parametric amplifiers that allow generation of sub 100 femtosecond pulses in the ultraviolet, visible, and infrared regions of the spectrum. 

ion-beam/electron-beam induced deposition of TEOS (insulator)

Major Equipment

ion-beam/electron-beam induced deposition of platinum

Major Equipment

low-kV e-beam lithography with NPGS

Major Equipment