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Equipment Catalog
Advanced Optical Spectroscopy and Microscopy
Major Equipment
Femtosecond Transient Absorption Spectrometer
Transient Abs. Helios:
Commercial absorption spectrometer capable to measure spectra and decays with 100 femtosecond resolution in VIS and NIR in combination with a 1 KHz regenerative amplifier and two TOPAS OPAs.
High-speed multiphoton laser scanning confocal imaging/hyperspectral imaging microscope
Confocal Leica TCS SP5:
The Leica TCS SP5 commercial inverted laser-scanning confocal fluorescence microscope (video rate) used for fluorescence, transmission and reflection imaging (400-800nm range).
Nanosecond Transient Absorption Spectrometer
Transient Abs. EOS:
Commercial absorption spectrometer capable to measure spectra and decays with nanosecond resolution in VIS and NIR in combination with a 1 KHz regenerative amplifier and two TOPAS OPAs.
Time and Spectrally Resolved Confocal Photoluminescence and Electroluminescence Microscope
Confocal UV-VIS 1X81:
The Olympus IX81 inverted microscope is used for time-resolved PL imaging and probing, including single photon source characterization.
Minor Equipment
Fluorimeter
Horiba Nanolog Fluorimeter:
This fluorimeter is best for organic and inorganic fluorescent materials, quantum dots, conductive polymers, protein, organic dyes.
Nikon Eclipse Ti2 Confocal Hyperspectral dark field/bright field/fluorescence imaging microscope
Nikon Eclipse Ti2 Hyperspectral Dark Field:
This is an inverted microscope used for recording scattering and fluorescence spectra, spectroelectrochemistry attachment, bright field imaging, chirality and polarization modes.
Scanning Photocurrent Microscope (SPCM)
SPCM:
Photocurrent imaging microscope capable of measuring maps of currents with submicron resolution from electrical devices incorporating semiconductor materials.
Time Correlated Single Photon Counting Spectrometer
Picoquant FT200:
The Fluorescence Lifetime Spectrometer is used for time-resolved emission probing in UV-VIS-NIR (400-850nm, 950-1450nm).
Advanced UV and X-ray Probes
Major Equipment
Soft Matter Interfaces SAXS/WAXS beamline at NSLS-II
SMI:
The CFN is a partner user on the Soft Matter Interfaces (SMI) beamline at Brookhaven's new, world-class synchrotron: the National Synchrotron Light Source II (NSLS-II). The SMI beamline provides world-leading capabilities to study the structure, energetics, and assembly of soft and hybrid materials, in particular focusing on the critical role of interfaces
XPEEM/LEEM Spectro-Microscopy Endstation
Beamline 21-ID at NSLS-II:
The CFN XPEEM/LEEM facility at the Electron Spectro-Microscopy (ESM, 21-ID-2) beamline at the National Synchrotron Light Source II (NSLS-II) has capabilities for full-field imaging at nanometer scale, as well as the micro-spot spectroscopy, including uXPS, uXAS and uARPES. The microscope is best suited for micro- spectroscopic investigation of conductive, crystalline surfaces with few nanometers spatial resolution.
Beamline 21-ID webpage: https://www.bnl.gov/nsls2/beamlines/beamline.php?r=21-ID
Electron Microscopy
Major Equipment
Analytical Bio/Soft Matter Transmission Electron Microscope (TEM)
JEOL 1400 TEM:
The JEOL JEM-1400 LaB6 120 kV transmission electron microscope is an easy-to-use, high contrast instrument with excellent imaging (TEM and STEM modes) and analytical (energy dispersive spectroscopy detector) capabilities.
Environmental Transmission Electron Microscope (E-TEM)
Titan 80-300:
The E-TEM instrument (FEI Titan 80-300) is an 80 – 300 kV field-emission transmission electron microscope with an objective-lens aberration corrector at spatial resolution of 0.08 nm. The instrument has scanning transmission imaging, magnetic imaging, and chemical analysis capabilities.
FEI TALOS Operando S/TEM
FEI TALOS:
The FEI Talos F200X is a high-resolution analytical scanning/transmission electron microscope (S/TEM) that is routinely operated at 200 keV. This microscope is equipped with an X-FEG electron source module that gives a source brightness four times that of a Schottky FEG emitter.
High Resolution Analytical Transmission Electron Microscope (HRTEM)
JEOL 2100F:
This is the center’s workhorse instrument. It is a 120-200kV scanning transmission and transmission field-emission electron microscope (STEM/TEM) for high-resolution analytical structural characterization.
Scanning Transmission Electron Microscope (STEM)
Hitachi 2700C:
This instrument is ideal for probing structural and electronic properties of materials at the Angstrom level, allowing on to study the physical, chemical and electronic structure of oxide interfaces, catalysts and other functional nanomaterials.
Materials Synthesis and Characterization
Major Equipment
2D material exfoliation
Customized capabilities for exfoliating 2D (atomically-thin) monolayers from parent van der Walls crystals.3-Tesla Cryogenic Micromanipulated Probe Station
3-Tesla Cryogenic Micromanipulated Probe Station:
The Janis ST-3T-2 is a continuous flow, vertical field, superconducting magnet micromanipulated probe station.
AJA Evaporator
AJA Orion:
The tool is a compact magnetron sputtering system designed for the sputtering deposition of metal and dielectric thin films. It is equipped with four RF sputtering sources and supports co-deposition of two materials at the same time.
Atomic Layer Deposition Tool (ALD) Savannah S100
Atomic Layer Deposition Tool:
The tool (Cambridge Nanotech Savannah100) includes precursors for atomically precise growth of thin films of Al2O3, ZnO, TiO2, VOx, HfO2, and Pt, at growth temperatures as high as 300 °C.
Electrospray Deposition
Electrospray Deposition (ESD) System:
This first-of-its kind instrument deposits soft and hybrid material thin films with programmable composition and/or thickness profiles by electrospraying from solution. Up to three separate solutions can be sprayed simultaneously onto heated substrates to generate binary and ternary composition profiles.
Fiji Plasma Enhanced Atomic Layer Deposition System
Veeco Fiji F200:
The PEALD tool is capable to depositing uniform, conformal thin films of various metallic, metal oxide, and metal nitride. It supports both conventional thermal ALD and plasma enhanced ALD. It is equipped with a quartz crystal microbalance for in-situ monitoring of thin film growth rate and accumulated thickness and a mesh pocket holder for deposition on powdered samples.
Hall Effect Measurement System
Room-temperature Hall Effect Measurement System:
This system is with available DC and AC measurement modes.
High Resolution Analytical Scanning Electron Microscope
JEOL JSM-7600F:
The JEOL JSM-7600F is a state-of-the-art thermal FE-SEM combining high resolution imaging with optimized analytical functionality.
High Temp Electrical Probe Sta/Annealing oven MBE Komponenten A0500
High-Temperature/Annealing Probe Station:
This probe station can perform rapid thermal annealing (up to 500 °C) in vacuum (2 mbar) or in a gas mixture atmosphere.
In-situ electrical characterization
Helios Nanolab 600:
In-situ electrical characterization in SEM/FIB
Miniflex X-Ray Diffractometer
Miniflex II:
The Miniflex II is capable of characterizing thin films, bulk powders, and surfaces.
Motorized stacker for 2D heterostructures
The stacker is a robotic motion system that precisely handles stamp-supported flakes and substrates for the stacking procedure to fabricate heterostructures.Photovoltaic Dev Characterization Sys - customized electrical probe station w/150W solar simulator, calibrated Si solar cell std
Solar Simulator:
Photovoltaic and photoelectrochemical device measurement system.
Photovoltaic Extrnl Quantum Efficiency Measurement Sys w/300W xenon arc lamp, monochromator, Si diode power meter, & precision
PV EQE:
External quantum efficiency measurement system.
Physical Property Measurement System (PPMS)
Dynacool 12T PPMS:
The PPMS performs low voltage DC and low frequency AC (< 200 Hz) electrical measurements from 0.35 K to 400 K under 0-12 T magnetic field.
Physical Vapor Sputter/Thermal Evaporator
PVD:
This thin film deposition system (Kurt J. Lesker PVD75) is used for the synthesis of inorganic thin films by thermal evaporation and DC magnetron sputtering.
Pulsed Laser Deposition System PLD/MBE 2300
PLD 2300:
The pulsed laser deposition system (PVD Products PLD-MBE 2300) is used for synthesis of complex metal oxides or nitride thin-films by laser ablation.
Room Temperature Electrical Probe Station
Room Temp Probe Station:
The Signatone CM-170 has four high quality micromanipulated probes for DC and low-frequency electrical characterization.
Scanning Electron Microscope (SEM)
Hitachi SEM:
This scanning electron microscope (Hitachi 4800 SEM) is a cold field emission instrument capable of 1.5 nm resolution at 15 kV and 2.5 nm resolution at 1 kV.
Small Angle X-Ray Scattering (SAXS/GISAXS/WAXS) with Cu rotating anode source
SaxsLabs SAXS:
The SaxsLabs Small Angle X-ray Scattering instrument investigates the structure of materials from angstroms to ~200 nm length scales by providing SAXS/GISAXS and WAXS capabilities.
Thermal Atomic Layer Deposition (ALD)
Thermal atomic layer deposition (ALD):
System for ultrathin, conformal coatings of high-quality dielectric materials and electroactive metal oxides
Variable Temperature Probe Station (70K-730K)
MMR:
The MMR VTMP spans the temperature range from 70 to 730 Kelvin under controlled atmosphere and optical excitation.
Wedge Wire Bonder
Wire Bonder:
The wedge bonder Kulicke & Soffa 4526 has semi-automatic and manual operation modes, and also individual bond parameters.
Witec Optical and Raman Microscope
Detecting 2D material flakes automatically engaged with optical image, Raman and AFMSmartLab Universal Diffractometer
SmartLab Universal Diffractometer:
Rigaku SmartLab is a universal diffractometer capable of characterizing thin films, bulk powders, and surfaces.
Minor Equipment
Automated Solvent Vapor Annealer (SVA)
The solvent vapor annealer is an instrument design for controlled swelling of polymer and other soft matter thin films by solvent vapors (e.g., THF, acetone). Automated swelling profiles can be programmed based on feedback control of nitrogen purge gas or substrate temperature using customized software.Battery Tester
Battery Tester:
This is advanced testing equipment for research and development of energy storage or electrochemical devices, such as batteries, supercapacitors, and fuel cells.
Biomolecular methods: cell culture, cold room, gel electrophoresis and DNA imaging
Bio Methods:
Cell culture, cold room, gel electrophoresis and DNA imaging.
Centrifuges, shakers, mixers, sonicators
Centrifuges, shakers, mixers, sonicators:
Available to provide fast separate substances and shaking or vortexing with tough metal housing at high speed, which is ideal for small volume liquid processing.
Circular Dichroism Spectrometer
Jasco J-815 Circular Dichroism (CD) Spectropolarimeter:
Circular dichroism (CD) spectroscopy measures differences in the absorption of left-handed polarized light versus right-handed polarized light that arise due to structural asymmetry.
Differential Scanning Calorimeter (DSC)
DSC:
The Perkin-Elmer Pyris Diamond DSC is used to perform differential scanning calorimetry measurements under helium purging in the temperature range of -170 °C to 300 °C
Dynamic Light Scattering with Zeta Potential
Malvern Zeta Sizer Nano Series:
This instrument (Malvern Zetasizer Nano ZS and Zeta Potential) measures the size (0.6 nm to 6000 nm) and zeta potential of dispersed particles in solution using a 633 nm He-Ne laser.
Electrochemical workstation
Environmental Atomic Force Microscope, Video-Rate Capability
Asylum Cypher AFM ES VRS:
Atomic force microscope with environmental control and video-rate capabilities.
Environmental Closed Loop Atomic Force Microscope
Asylum AFM:
This AFM (Asylum MFP-3D-BIOsystem) provides low noise performance with closed loop sensors in all three axes.
Epifluorescent and Polarized Imaging Microscope
Olympus Polarized Microscope:
Upright microscope for routine epifluorescent, polarized and bright field or dark field imaging.
FTIR Spectrometer
Nicolet 6700 FT-IR Spectrometer:
Fourier Transform Infrared (FT-IR) Spectrometer.
Flow Coater
CFN Manufactured Flow Coater:
The flow coater is a compact apparatus for casting uniform films of nanoparticles, molecules, or polymers from solution with user-designed film thickness increments or gradients.
Hybrid Rheometer
Discovery HR-3 Rheometer:
The instrument is designed to measure mechanical/rheological properties of soft materials, including gels, liquids, and assemblies of macromolecules or nanoparticles at air-liquid interfaces.
LightCycler 480 instrument
Real-Time PCR:
The LightCycler® 480 system enables you to perform real-time, online PCR combined with rapid cycling of up to 96 or 384 samples.
Particle Sizing and Tracking
Nanosight:
The instrument provides characterization of nanoparticle sizes and diffusion in liquids.
Photon Counting Spectrofluorometer
ISS PC1/K2 Fluorometer:
This fluorometer (ISS PC1 Multifrequency Cross-Correlation Phase and Modulation Fluorometer) is capable of steady state and lifetime measurements (from 1 millisecond to 1 picosecond).
Reactive Ion Etcher (RIE)
March RIE:
This tool (March Plasma CS1701F) is used for radio frequency (RF) plasma etching of organic and inorganic thin films using combinations of six process gases (SF6, CF4, CHF3, O2, Ar, and CF3Br).
Spectroscopic Ellipsometer
Woollam M2000:
This ellipsometer (J.A. Woollam M-2000 Spectroscopic Ellipsometer) allows analysis and mapping of thin films and interfaces, with temperature control in air and liquids.
Spin Coater
Laurell WS-650-23 Spin Coater:
This tool is used for forming organic thin films from solution. System includes a spin coater with variable spin speed/acceleration (between ~500-6000 RPM). It is located in the 6 foot wide hood (1L-10-1) (with HEPA filtration on the hood exhaust), suitable for nanomaterial processing.
Sputter/Coater
Cressington 208HR Coater:
This benchtop DC sputter coater deposits thin noble metal films (Au, AuPd, or Pt) by DC sputtering. It is typically used for preparing samples for scanning electron microscopy.
Thermo Gravimetric/Differential Thermal Analyzer (TGA/DTA)
TGA/DTA:
The Perkin-Elmer Pyris Diamond TGA/DTA is used to perform thermogravimetric and differential thermal analytic measurements.
Uv-Vis Spectrophotometer
PerkinElmer UV-Vis Lambda 25:
UV/Vis Spectrophotometer
Uv-Vis/NIR Spectrophotometer with 60mm integrating sphere
PerkinElmer Lambda 950:
In addition to liquid sample measurements, the instrument is equipped for studies of films and powders in specular and diffuse scattering regimes.
Wet chemistry synthesis/functionalization of nano-scale and organic materials
Wet Chemistry:
Capabilities required for the synthesis, fabrication and study of novel hybrid structures and functionalities.
Nanofabrication
Major Equipment
3-D Laser Lithography System (Photonic Professional GT)
3-D Litho:
This tool (Nanoscribe Photonic Professional GT) is an automatic 3-D nanolithography system/3-D printer capable of creating polymer patterns/models down to sub-200 nm resolution using two-photon polymerization technique.
Deep Reactive Ion Etcher, available w/Bosch process (DRIE)
Silicon DRIE:
This system has demonstrated capability to etch vertical walls in silicon to a depth of 300 µm at etch rates of 3 µm / min with an aspect ratio (width of feature to etch depth) of 1:50. It has a laser interferometer endpoint detector (shared with the other Oxford ICP RIE tool) to help achieving an accurate etching depth.
Dual Beam Scanning Electron/Focused Ion Beam Microscope
Dual Beam:
Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.
Electron Beam Deposition System
Ebeam Deposit:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Electron Beam Induced Current (EBIC) Imaging-Helios G5
Electron Beam Induced Current (EBIC) Imaging:
EBIC is an analysis technique in the SEM, which creates images using the electrical response of the sample as a function of the scanning position of the electron beam.Electron Beam Lithography Tool (EBL)
Ebeam Litho:
The JEOL JBX-6300FS is a state-of-the-art 100kV EBL tool providing high-speed patterning capabilities with feature sizes as small as 8 nm over mm-scale areas.
General purpose Reactive Ion Etcher
Trion RIE:
The general purpose plasma etch tool (Trion Phantom III) is used for etching thin films generally 1 µm or less in thickness.
Helios G5 Dual Beam SEM/FIB Microscope
Helios G5 Dual Beam SEM/FIB Microscope:
Excellent electron and FIB imaging resolution (including at FIB energies below 2 keV). It possesses an array of imaging, analysis, device fabrication, electrical characterization, and TEM sample preparation capabilities.
In-Situ Electrical Characterization-Helios G5
The Helios G5 has two ways to perform in-situ electrical characterization. One is to use the 7-pin SMA electrical feedthrough, which requires fixed wiring of the electrodes to the sample or device. The other is to perform two-terminal electrical probing (no need for fixed wiring) using two Kleindiek Nanotechnik robotic manipulators (fA-range current measurement resolution and nanometer scale positioning resolution).Oxford Chlorine Etcher C (RIE-C)
Oxford Metal Etcher:
This ICP Reactive Ion Etching system (Oxford Instruments Plasmalab 100) has an inductively coupled plasma source for high-speed, anisotropic plasma etching.
Plasma Enhanced Chemical Vapor Deposition (PECVD) System
Trion PECVD:
This deposition system (Trion Orion III) provides plasma-enhanced chemical vapor deposition of thin films. Current capabilities include precursor gases for deposition of SiO2, Si3N4, and amorphous silicon films.
UV Mask Aligner
UV Mask Align:
The system (Karl Suss MA-6 UV Mask Aligner) is capable of exposing photoresist patterns down to 1 micron resolution with UV light at two wavelengths (405 nm and 240m nm).
Minor Equipment
Constant Temperature bath (-20°C to 100°C)
Dektak 150 Stylus Profilometer
Dektak 150 Stylus Profilometer:
Single scan contact profilometer with a scan length range 50 um to 55 mm and a sub 1 nm specified vertical resolution.
L-EDIT (CAD)
Layout Beamer (pattern fracture & proximity effect correction)
Liquid CO2 Critical Point Dryer (Autosamdri-815B)
CPD:Plasma Asher
Plasma AsherReflectometer
Filmetric F20:
This tool (Filmetrics F20) is a spectro-reflectometer which measures the thickness and reflective index of thin film deposited on flat substrate. It can handle samples with multilayer thin film.
Sputter Coater
PVD75 Coater:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Thermal/E-beam evaporator for electrical contacts
Contacts Evaporator:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Proximal Probes
Major Equipment
Ambient Pressure PES with in vacuo IRRAS
Lab AP-PES:
This instrument allows for surface chemical analysis via core-level (XPS) and valance-level (UPS) photoelectron spectroscopy at gas pressures up to ~ 10 Torr and sample temperatures up to 500 °C. Applications include in-operando studies of surface chemistry, catalysis, and energy storage processes.
Low Energy Electron Microscope V (LEEM)
LEEM V:
A field-emission low-energy electron microscope (Elmitec LEEM V) allows for in-situ microscopic studies of dynamic surface processes.
Low-Temperature UHV Scanning Tunneling/Force Microscope
Createc STM:
The Customized Createc low-temperature UHV ultra resolution scanning tunneling (STM) and atomic force microscope (NC-AFM, functionalized tip, Q-Plus sensor/30kHz) is equipped with molecular structure imaging capability operating at 5K. Full time supported.
NanoIR/s-SNOM
NanoIR/s-SNOM:
The NanoIR instrument is capable of performing both scattering-type scanning near-field optical microscopy (s-SNOM) and photothermal infrared spectromicroscopy (PTIR) with a spatial resolution of 10nm in tapping mode and 50nm in contact mode.
Reactor Scanning Tunneling Microscope (STM)
Reactor STM:
The reactor-Scanning Tunneling Microscopy (r-STM) allows STM measurements of a surface from UHV to 3 atm.
Scanning Electron Microscope/Scanning Auger Microscopy/4-point Transport Measurement of Nanostructures
Nanoprobe:
This Nanoprobe system is capable of performing scanning electron microscopy (SEM), scanning Auger microscopy (nanoSAM), 4-point probe measurements, and low energy electron diffraction (LEED).
UHV Multiprobe Surface Analysis System - STM/XPS/UPS/ISS/LEED/TPD
Multiprobe:
Capable of surface structural characterization; surface chemical composition and electronic state characterization and UHV in-situ sample preparation and nanostructure fabrication.
mIRage O-PTIR + Raman
The mIRage optical-photothermal infrared (O-PTIR) plus Raman instrument provides sub-500nm spatially resolved infrared and Raman spectra on the same spot at the same time with the same spatial resolution.
Minor Equipment
Bruker Vertex 80v Spectrometer w/UHV IRRAS and Powder Transmission Capabilities
Bruker FTIR:
For transmission and reflectance IR measurements from UHV to atmospheric pressure.
Park NX-20 Atomic Force Microscope
AFM:
The Park NX-20 atomic force microscope is capable of surface imaging at ambient conditions at room temperature, as well as at elevated temperatures.
WiTec Alpha Combination Microscope
Raman:
WiTec Alpha combination microscope for atomic force microscopy, scanning near-field optical microscopy, confocal microscopy, and confocal Raman microscopy within the same field of view.
Theory and Computation
Major Equipment
Software and Computational Services
Computer clusters, software and data storage:
We have diverse software tools that include deep learning frameworks, density functional theory packages for solids, surface and quantum chemistry, molecular-dynamics packages, and specialized tools for electronic excitations and optical properties.
Advanced Spectro-Microscopy
Major Equipment
XPEEM/LEEM Spectro-Microscopy Endstation
Beamline 21-ID at NSLS-II:
The CFN XPEEM/LEEM facility at the Electron Spectro-Microscopy (ESM, 21-ID-2) beamline at the National Synchrotron Light Source II (NSLS-II) has capabilities for full-field imaging at nanometer scale, as well as the micro-spot spectroscopy, including uXPS, uXAS and uARPES. The microscope is best suited for micro- spectroscopic investigation of conductive, crystalline surfaces with few nanometers spatial resolution.
Beamline 21-ID webpage: https://www.bnl.gov/nsls2/beamlines/beamline.php?r=21-ID
Deposition (Evaporators/Sputterers/Pecvd/Coaters)
Major Equipment
AJA Evaporator
AJA Orion:
The tool is a compact magnetron sputtering system designed for the sputtering deposition of metal and dielectric thin films. It is equipped with four RF sputtering sources and supports co-deposition of two materials at the same time.
Atomic Layer Deposition Tool (ALD) Savannah S100
Atomic Layer Deposition Tool:
The tool (Cambridge Nanotech Savannah100) includes precursors for atomically precise growth of thin films of Al2O3, ZnO, TiO2, VOx, HfO2, and Pt, at growth temperatures as high as 300 °C.
Electron Beam Deposition System
Ebeam Deposit:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Electrospray Deposition
Electrospray Deposition (ESD) System:
This first-of-its kind instrument deposits soft and hybrid material thin films with programmable composition and/or thickness profiles by electrospraying from solution. Up to three separate solutions can be sprayed simultaneously onto heated substrates to generate binary and ternary composition profiles.
Fiji Plasma Enhanced Atomic Layer Deposition System
Veeco Fiji F200:
The PEALD tool is capable to depositing uniform, conformal thin films of various metallic, metal oxide, and metal nitride. It supports both conventional thermal ALD and plasma enhanced ALD. It is equipped with a quartz crystal microbalance for in-situ monitoring of thin film growth rate and accumulated thickness and a mesh pocket holder for deposition on powdered samples.
Physical Vapor Sputter/Thermal Evaporator
PVD:
This thin film deposition system (Kurt J. Lesker PVD75) is used for the synthesis of inorganic thin films by thermal evaporation and DC magnetron sputtering.
Plasma Enhanced Chemical Vapor Deposition (PECVD) System
Trion PECVD:
This deposition system (Trion Orion III) provides plasma-enhanced chemical vapor deposition of thin films. Current capabilities include precursor gases for deposition of SiO2, Si3N4, and amorphous silicon films.
Pulsed Laser Deposition System PLD/MBE 2300
PLD 2300:
The pulsed laser deposition system (PVD Products PLD-MBE 2300) is used for synthesis of complex metal oxides or nitride thin-films by laser ablation.
Thermal Atomic Layer Deposition (ALD)
Thermal atomic layer deposition (ALD):
System for ultrathin, conformal coatings of high-quality dielectric materials and electroactive metal oxides
Minor Equipment
Flow Coater
CFN Manufactured Flow Coater:
The flow coater is a compact apparatus for casting uniform films of nanoparticles, molecules, or polymers from solution with user-designed film thickness increments or gradients.
Spin Coater
Laurell WS-650-23 Spin Coater:
This tool is used for forming organic thin films from solution. System includes a spin coater with variable spin speed/acceleration (between ~500-6000 RPM). It is located in the 6 foot wide hood (1L-10-1) (with HEPA filtration on the hood exhaust), suitable for nanomaterial processing.
Sputter Coater
PVD75 Coater:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Sputter/Coater
Cressington 208HR Coater:
This benchtop DC sputter coater deposits thin noble metal films (Au, AuPd, or Pt) by DC sputtering. It is typically used for preparing samples for scanning electron microscopy.
Thermal/E-beam evaporator for electrical contacts
Contacts Evaporator:
Three separate physical vapor deposition systems (all Kurt J. Lesker PVD75) are available for thin-film sputter, thermal, and electron-beam deposition of a wide variety of materials.
Electrical Probing
Major Equipment
3-Tesla Cryogenic Micromanipulated Probe Station
3-Tesla Cryogenic Micromanipulated Probe Station:
The Janis ST-3T-2 is a continuous flow, vertical field, superconducting magnet micromanipulated probe station.
Hall Effect Measurement System
Room-temperature Hall Effect Measurement System:
This system is with available DC and AC measurement modes.
High Temp Electrical Probe Sta/Annealing oven MBE Komponenten A0500
High-Temperature/Annealing Probe Station:
This probe station can perform rapid thermal annealing (up to 500 °C) in vacuum (2 mbar) or in a gas mixture atmosphere.
In-Situ Electrical Characterization-Helios G5
The Helios G5 has two ways to perform in-situ electrical characterization. One is to use the 7-pin SMA electrical feedthrough, which requires fixed wiring of the electrodes to the sample or device. The other is to perform two-terminal electrical probing (no need for fixed wiring) using two Kleindiek Nanotechnik robotic manipulators (fA-range current measurement resolution and nanometer scale positioning resolution).In-situ electrical characterization
Helios Nanolab 600:
In-situ electrical characterization in SEM/FIB
Photovoltaic Dev Characterization Sys - customized electrical probe station w/150W solar simulator, calibrated Si solar cell std
Solar Simulator:
Photovoltaic and photoelectrochemical device measurement system.
Photovoltaic Extrnl Quantum Efficiency Measurement Sys w/300W xenon arc lamp, monochromator, Si diode power meter, & precision
PV EQE:
External quantum efficiency measurement system.
Physical Property Measurement System (PPMS)
Dynacool 12T PPMS:
The PPMS performs low voltage DC and low frequency AC (< 200 Hz) electrical measurements from 0.35 K to 400 K under 0-12 T magnetic field.
Room Temperature Electrical Probe Station
Room Temp Probe Station:
The Signatone CM-170 has four high quality micromanipulated probes for DC and low-frequency electrical characterization.
Variable Temperature Probe Station (70K-730K)
MMR:
The MMR VTMP spans the temperature range from 70 to 730 Kelvin under controlled atmosphere and optical excitation.
Wedge Wire Bonder
Wire Bonder:
The wedge bonder Kulicke & Soffa 4526 has semi-automatic and manual operation modes, and also individual bond parameters.
Minor Equipment
Battery Tester
Battery Tester:
This is advanced testing equipment for research and development of energy storage or electrochemical devices, such as batteries, supercapacitors, and fuel cells.
Scanning Photocurrent Microscope (SPCM)
SPCM:
Photocurrent imaging microscope capable of measuring maps of currents with submicron resolution from electrical devices incorporating semiconductor materials.
Electron Microscopy
Major Equipment
Analytical Bio/Soft Matter Transmission Electron Microscope (TEM)
JEOL 1400 TEM:
The JEOL JEM-1400 LaB6 120 kV transmission electron microscope is an easy-to-use, high contrast instrument with excellent imaging (TEM and STEM modes) and analytical (energy dispersive spectroscopy detector) capabilities.
Dual Beam Scanning Electron/Focused Ion Beam Microscope
Dual Beam:
Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.
Electron Beam Induced Current (EBIC) Imaging-Helios G5
Electron Beam Induced Current (EBIC) Imaging:
EBIC is an analysis technique in the SEM, which creates images using the electrical response of the sample as a function of the scanning position of the electron beam.Environmental Transmission Electron Microscope (E-TEM)
Titan 80-300:
The E-TEM instrument (FEI Titan 80-300) is an 80 – 300 kV field-emission transmission electron microscope with an objective-lens aberration corrector at spatial resolution of 0.08 nm. The instrument has scanning transmission imaging, magnetic imaging, and chemical analysis capabilities.
FEI TALOS Operando S/TEM
FEI TALOS:
The FEI Talos F200X is a high-resolution analytical scanning/transmission electron microscope (S/TEM) that is routinely operated at 200 keV. This microscope is equipped with an X-FEG electron source module that gives a source brightness four times that of a Schottky FEG emitter.
Helios G5 Dual Beam SEM/FIB Microscope
Helios G5 Dual Beam SEM/FIB Microscope:
Excellent electron and FIB imaging resolution (including at FIB energies below 2 keV). It possesses an array of imaging, analysis, device fabrication, electrical characterization, and TEM sample preparation capabilities.
High Resolution Analytical Scanning Electron Microscope
JEOL JSM-7600F:
The JEOL JSM-7600F is a state-of-the-art thermal FE-SEM combining high resolution imaging with optimized analytical functionality.
High Resolution Analytical Transmission Electron Microscope (HRTEM)
JEOL 2100F:
This is the center’s workhorse instrument. It is a 120-200kV scanning transmission and transmission field-emission electron microscope (STEM/TEM) for high-resolution analytical structural characterization.
Scanning Electron Microscope (SEM)
Hitachi SEM:
This scanning electron microscope (Hitachi 4800 SEM) is a cold field emission instrument capable of 1.5 nm resolution at 15 kV and 2.5 nm resolution at 1 kV.
Scanning Electron Microscope/Scanning Auger Microscopy/4-point Transport Measurement of Nanostructures
Nanoprobe:
This Nanoprobe system is capable of performing scanning electron microscopy (SEM), scanning Auger microscopy (nanoSAM), 4-point probe measurements, and low energy electron diffraction (LEED).
Scanning Transmission Electron Microscope (STEM)
Hitachi 2700C:
This instrument is ideal for probing structural and electronic properties of materials at the Angstrom level, allowing on to study the physical, chemical and electronic structure of oxide interfaces, catalysts and other functional nanomaterials.
Etching and Ashing
Major Equipment
Deep Reactive Ion Etcher, available w/Bosch process (DRIE)
Silicon DRIE:
This system has demonstrated capability to etch vertical walls in silicon to a depth of 300 µm at etch rates of 3 µm / min with an aspect ratio (width of feature to etch depth) of 1:50. It has a laser interferometer endpoint detector (shared with the other Oxford ICP RIE tool) to help achieving an accurate etching depth.
General purpose Reactive Ion Etcher
Trion RIE:
The general purpose plasma etch tool (Trion Phantom III) is used for etching thin films generally 1 µm or less in thickness.
Oxford Chlorine Etcher C (RIE-C)
Oxford Metal Etcher:
This ICP Reactive Ion Etching system (Oxford Instruments Plasmalab 100) has an inductively coupled plasma source for high-speed, anisotropic plasma etching.
Minor Equipment
Liquid CO2 Critical Point Dryer (Autosamdri-815B)
CPD:Plasma Asher
Plasma AsherReactive Ion Etcher (RIE)
March RIE:
This tool (March Plasma CS1701F) is used for radio frequency (RF) plasma etching of organic and inorganic thin films using combinations of six process gases (SF6, CF4, CHF3, O2, Ar, and CF3Br).
Lithography
Major Equipment
3-D Laser Lithography System (Photonic Professional GT)
3-D Litho:
This tool (Nanoscribe Photonic Professional GT) is an automatic 3-D nanolithography system/3-D printer capable of creating polymer patterns/models down to sub-200 nm resolution using two-photon polymerization technique.
Dual Beam Scanning Electron/Focused Ion Beam Microscope
Dual Beam:
Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.
Electron Beam Lithography Tool (EBL)
Ebeam Litho:
The JEOL JBX-6300FS is a state-of-the-art 100kV EBL tool providing high-speed patterning capabilities with feature sizes as small as 8 nm over mm-scale areas.
Helios G5 Dual Beam SEM/FIB Microscope
Helios G5 Dual Beam SEM/FIB Microscope:
Excellent electron and FIB imaging resolution (including at FIB energies below 2 keV). It possesses an array of imaging, analysis, device fabrication, electrical characterization, and TEM sample preparation capabilities.
UV Mask Aligner
UV Mask Align:
The system (Karl Suss MA-6 UV Mask Aligner) is capable of exposing photoresist patterns down to 1 micron resolution with UV light at two wavelengths (405 nm and 240m nm).
Optical Microscopy
Major Equipment
High-speed multiphoton laser scanning confocal imaging/hyperspectral imaging microscope
Confocal Leica TCS SP5:
The Leica TCS SP5 commercial inverted laser-scanning confocal fluorescence microscope (video rate) used for fluorescence, transmission and reflection imaging (400-800nm range).
Time and Spectrally Resolved Confocal Photoluminescence and Electroluminescence Microscope
Confocal UV-VIS 1X81:
The Olympus IX81 inverted microscope is used for time-resolved PL imaging and probing, including single photon source characterization.
Minor Equipment
Epifluorescent and Polarized Imaging Microscope
Olympus Polarized Microscope:
Upright microscope for routine epifluorescent, polarized and bright field or dark field imaging.
Nikon Eclipse Ti2 Confocal Hyperspectral dark field/bright field/fluorescence imaging microscope
Nikon Eclipse Ti2 Hyperspectral Dark Field:
This is an inverted microscope used for recording scattering and fluorescence spectra, spectroelectrochemistry attachment, bright field imaging, chirality and polarization modes.
Proximal Probes
Major Equipment
Ambient Pressure PES with in vacuo IRRAS
Lab AP-PES:
This instrument allows for surface chemical analysis via core-level (XPS) and valance-level (UPS) photoelectron spectroscopy at gas pressures up to ~ 10 Torr and sample temperatures up to 500 °C. Applications include in-operando studies of surface chemistry, catalysis, and energy storage processes.
NanoIR/s-SNOM
NanoIR/s-SNOM:
The NanoIR instrument is capable of performing both scattering-type scanning near-field optical microscopy (s-SNOM) and photothermal infrared spectromicroscopy (PTIR) with a spatial resolution of 10nm in tapping mode and 50nm in contact mode.
UHV Multiprobe Surface Analysis System - STM/XPS/UPS/ISS/LEED/TPD
Multiprobe:
Capable of surface structural characterization; surface chemical composition and electronic state characterization and UHV in-situ sample preparation and nanostructure fabrication.
mIRage O-PTIR + Raman
The mIRage optical-photothermal infrared (O-PTIR) plus Raman instrument provides sub-500nm spatially resolved infrared and Raman spectra on the same spot at the same time with the same spatial resolution.
Minor Equipment
Bruker Vertex 80v Spectrometer w/UHV IRRAS and Powder Transmission Capabilities
Bruker FTIR:
For transmission and reflectance IR measurements from UHV to atmospheric pressure.
Rheology
Minor Equipment
Hybrid Rheometer
Discovery HR-3 Rheometer:
The instrument is designed to measure mechanical/rheological properties of soft materials, including gels, liquids, and assemblies of macromolecules or nanoparticles at air-liquid interfaces.
Scanning and Probing Microscopy
Major Equipment
Low Energy Electron Microscope V (LEEM)
LEEM V:
A field-emission low-energy electron microscope (Elmitec LEEM V) allows for in-situ microscopic studies of dynamic surface processes.
Low-Temperature UHV Scanning Tunneling/Force Microscope
Createc STM:
The Customized Createc low-temperature UHV ultra resolution scanning tunneling (STM) and atomic force microscope (NC-AFM, functionalized tip, Q-Plus sensor/30kHz) is equipped with molecular structure imaging capability operating at 5K. Full time supported.
Reactor Scanning Tunneling Microscope (STM)
Reactor STM:
The reactor-Scanning Tunneling Microscopy (r-STM) allows STM measurements of a surface from UHV to 3 atm.
Minor Equipment
Environmental Atomic Force Microscope, Video-Rate Capability
Asylum Cypher AFM ES VRS:
Atomic force microscope with environmental control and video-rate capabilities.
Environmental Closed Loop Atomic Force Microscope
Asylum AFM:
This AFM (Asylum MFP-3D-BIOsystem) provides low noise performance with closed loop sensors in all three axes.
Park NX-20 Atomic Force Microscope
AFM:
The Park NX-20 atomic force microscope is capable of surface imaging at ambient conditions at room temperature, as well as at elevated temperatures.
WiTec Alpha Combination Microscope
Raman:
WiTec Alpha combination microscope for atomic force microscopy, scanning near-field optical microscopy, confocal microscopy, and confocal Raman microscopy within the same field of view.
Solution Based and Biomolecular Methods
Minor Equipment
Biomolecular methods: cell culture, cold room, gel electrophoresis and DNA imaging
Bio Methods:
Cell culture, cold room, gel electrophoresis and DNA imaging.
Centrifuges, shakers, mixers, sonicators
Centrifuges, shakers, mixers, sonicators:
Available to provide fast separate substances and shaking or vortexing with tough metal housing at high speed, which is ideal for small volume liquid processing.
LightCycler 480 instrument
Real-Time PCR:
The LightCycler® 480 system enables you to perform real-time, online PCR combined with rapid cycling of up to 96 or 384 samples.
Particle Sizing and Tracking
Nanosight:
The instrument provides characterization of nanoparticle sizes and diffusion in liquids.
Wet chemistry synthesis/functionalization of nano-scale and organic materials
Wet Chemistry:
Capabilities required for the synthesis, fabrication and study of novel hybrid structures and functionalities.
Spectroscopic and Time-Resolved Probing
Major Equipment
Femtosecond Transient Absorption Spectrometer
Transient Abs. Helios:
Commercial absorption spectrometer capable to measure spectra and decays with 100 femtosecond resolution in VIS and NIR in combination with a 1 KHz regenerative amplifier and two TOPAS OPAs.
Nanosecond Transient Absorption Spectrometer
Transient Abs. EOS:
Commercial absorption spectrometer capable to measure spectra and decays with nanosecond resolution in VIS and NIR in combination with a 1 KHz regenerative amplifier and two TOPAS OPAs.
Minor Equipment
Circular Dichroism Spectrometer
Jasco J-815 Circular Dichroism (CD) Spectropolarimeter:
Circular dichroism (CD) spectroscopy measures differences in the absorption of left-handed polarized light versus right-handed polarized light that arise due to structural asymmetry.
FTIR Spectrometer
Nicolet 6700 FT-IR Spectrometer:
Fourier Transform Infrared (FT-IR) Spectrometer.
Fluorimeter
Horiba Nanolog Fluorimeter:
This fluorimeter is best for organic and inorganic fluorescent materials, quantum dots, conductive polymers, protein, organic dyes.
Photon Counting Spectrofluorometer
ISS PC1/K2 Fluorometer:
This fluorometer (ISS PC1 Multifrequency Cross-Correlation Phase and Modulation Fluorometer) is capable of steady state and lifetime measurements (from 1 millisecond to 1 picosecond).
Time Correlated Single Photon Counting Spectrometer
Picoquant FT200:
The Fluorescence Lifetime Spectrometer is used for time-resolved emission probing in UV-VIS-NIR (400-850nm, 950-1450nm).
Uv-Vis Spectrophotometer
PerkinElmer UV-Vis Lambda 25:
UV/Vis Spectrophotometer
Uv-Vis/NIR Spectrophotometer with 60mm integrating sphere
PerkinElmer Lambda 950:
In addition to liquid sample measurements, the instrument is equipped for studies of films and powders in specular and diffuse scattering regimes.
Theory Computation & Software
Major Equipment
Software and Computational Services
Computer clusters, software and data storage:
We have diverse software tools that include deep learning frameworks, density functional theory packages for solids, surface and quantum chemistry, molecular-dynamics packages, and specialized tools for electronic excitations and optical properties.
Thermal Analysis, Annealing and Electrochemistry
Minor Equipment
Automated Solvent Vapor Annealer (SVA)
The solvent vapor annealer is an instrument design for controlled swelling of polymer and other soft matter thin films by solvent vapors (e.g., THF, acetone). Automated swelling profiles can be programmed based on feedback control of nitrogen purge gas or substrate temperature using customized software.Constant Temperature bath (-20°C to 100°C)
Differential Scanning Calorimeter (DSC)
DSC:
The Perkin-Elmer Pyris Diamond DSC is used to perform differential scanning calorimetry measurements under helium purging in the temperature range of -170 °C to 300 °C
Electrochemical workstation
Thermo Gravimetric/Differential Thermal Analyzer (TGA/DTA)
TGA/DTA:
The Perkin-Elmer Pyris Diamond TGA/DTA is used to perform thermogravimetric and differential thermal analytic measurements.
Thin Film Metrology
Major Equipment
SmartLab Universal Diffractometer
SmartLab Universal Diffractometer:
Rigaku SmartLab is a universal diffractometer capable of characterizing thin films, bulk powders, and surfaces.
Minor Equipment
Dektak 150 Stylus Profilometer
Dektak 150 Stylus Profilometer:
Single scan contact profilometer with a scan length range 50 um to 55 mm and a sub 1 nm specified vertical resolution.
Reflectometer
Filmetric F20:
This tool (Filmetrics F20) is a spectro-reflectometer which measures the thickness and reflective index of thin film deposited on flat substrate. It can handle samples with multilayer thin film.
Spectroscopic Ellipsometer
Woollam M2000:
This ellipsometer (J.A. Woollam M-2000 Spectroscopic Ellipsometer) allows analysis and mapping of thin films and interfaces, with temperature control in air and liquids.
X-Ray and Light Scattering
Major Equipment
Miniflex X-Ray Diffractometer
Miniflex II:
The Miniflex II is capable of characterizing thin films, bulk powders, and surfaces.
Small Angle X-Ray Scattering (SAXS/GISAXS/WAXS) with Cu rotating anode source
SaxsLabs SAXS:
The SaxsLabs Small Angle X-ray Scattering instrument investigates the structure of materials from angstroms to ~200 nm length scales by providing SAXS/GISAXS and WAXS capabilities.
Soft Matter Interfaces SAXS/WAXS beamline at NSLS-II
SMI:
The CFN is a partner user on the Soft Matter Interfaces (SMI) beamline at Brookhaven's new, world-class synchrotron: the National Synchrotron Light Source II (NSLS-II). The SMI beamline provides world-leading capabilities to study the structure, energetics, and assembly of soft and hybrid materials, in particular focusing on the critical role of interfaces
SmartLab Universal Diffractometer
SmartLab Universal Diffractometer:
Rigaku SmartLab is a universal diffractometer capable of characterizing thin films, bulk powders, and surfaces.
Minor Equipment
Dynamic Light Scattering with Zeta Potential
Malvern Zeta Sizer Nano Series:
This instrument (Malvern Zetasizer Nano ZS and Zeta Potential) measures the size (0.6 nm to 6000 nm) and zeta potential of dispersed particles in solution using a 633 nm He-Ne laser.
3D Surface Metrology in SEM
Major Equipment
High Resolution Analytical Scanning Electron Microscope
JEOL JSM-7600F:
The JEOL JSM-7600F is a state-of-the-art thermal FE-SEM combining high resolution imaging with optimized analytical functionality.
Focused Ion Beam
Major Equipment
Dual Beam Scanning Electron/Focused Ion Beam Microscope
Dual Beam:
Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.
Low Angle Backscattered Electron Detector (LABE)
Major Equipment
High Resolution Analytical Scanning Electron Microscope
JEOL JSM-7600F:
The JEOL JSM-7600F is a state-of-the-art thermal FE-SEM combining high resolution imaging with optimized analytical functionality.
STEM imaging
Major Equipment
High Resolution Analytical Scanning Electron Microscope
JEOL JSM-7600F:
The JEOL JSM-7600F is a state-of-the-art thermal FE-SEM combining high resolution imaging with optimized analytical functionality.
X-ray Energy Dispersive Spectroscopy (EDS)-Oxford Inca Energy
Major Equipment
High Resolution Analytical Scanning Electron Microscope
JEOL JSM-7600F:
The JEOL JSM-7600F is a state-of-the-art thermal FE-SEM combining high resolution imaging with optimized analytical functionality.
X-ray Wavelength Dispersive Spectroscopy (WDS)-Oxford Inca Wave
Major Equipment
High Resolution Analytical Scanning Electron Microscope
JEOL JSM-7600F:
The JEOL JSM-7600F is a state-of-the-art thermal FE-SEM combining high resolution imaging with optimized analytical functionality.
ion-beam/electron-beam induced deposition of TEOS (insulator)
Major Equipment
Dual Beam Scanning Electron/Focused Ion Beam Microscope
Dual Beam:
Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.
ion-beam/electron-beam induced deposition of platinum
Major Equipment
Dual Beam Scanning Electron/Focused Ion Beam Microscope
Dual Beam:
Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.
low-kV e-beam lithography with NPGS
Major Equipment
Dual Beam Scanning Electron/Focused Ion Beam Microscope
Dual Beam:
Dual Beam Scanning Electron/Focused Ion Beam Microscope (FEI Helios), capable of simultaneous focused ion beam milling and SEM imaging.